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Offered technologies

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A list of all offered materials, along with laminate and copper thicknesses is presented below. Detailed information can be obtained in the order form, specifying technological parameters of your PCB.

Offered laminates
Laminate FR4	Laminate ALU	Microwave laminate ROGERS

Fields marked with * are required

Laminate type *	FR4, Polytherm TC-Lam 1,3, RT/duroid® 5870 /5880, RO4003, RO3003
Layer number *	1, 2, 4, 6, 8
Laminate thickness [mm] *	0,25; 0,31; 0,36; 0,41; 0,5; 0,51; 0,55; 0,75; 0,79; 0,8; 0,81; 1; 1,2; 1,53; 1,55; 1,58; 1,6; 2; 2,4; 3; 3,175; 3,2; other
Thermal conductivity [W/mK] *	0,8; 1,3
End copper thickness on external layers [µm] *	8, 18, 35, 70, 105, other
End copper thickness on inner layers [µm] *	18, 35, 70, 105, other
soldermask TOP *	green, white, blue, red, black
soldermask BOT *	green, white, blue, red, black
silkscreen TOP *	white, yellow, blue, red, black
silkscreen BOT *	white, yellow, blue, red, black
Surface finishing *	lead-free HAL , chemical gold
Additional options *	peelable mask, covered vias, UL certificate, testing, paste stencil
Mechanical machining *	milling, scoring, blind vias, depth milling, chamfering
Minimum end hole diameter [mm]
for laminate thickness ALU, 1,0-1,6 mm	0,8
for laminate thickness ALU, 2,0 mm	1
for laminate thickness ALU, 3,2 mm	1,6
for laminate thickness 1,5 mm	0,2
for laminate thickness 1,6 mm	0,2
for laminate thickness 2,4 mm	0,3
for laminate thickness 3,2 mm	0,5
Minimum track to track spacing / minimum track width [mils]
for end Cu thickness 35 µm	4/4
for end Cu thickness 70 µm	5/5
for end Cu thickness 105 µm	8/10
Minimum annular ring [mils]	6, 8, 10